Each year thousands of healthcare professionals from around the world gather for three days to advance their network and learn about evidence-based advances in infection prevention.
Join your colleagues at APIC 2017 to learn about the latest research and science and to discover real-world solutions to challenging infection prevention issues. APIC’s 44th Annual Conference is the premier forum for infection prevention and epidemiology professionals.
Need another reason to attend? Here are five more.
Learn from the experts.
The conference features three days of 90+ cutting-edge educational sessions and workshops, plus pre-conference workshops from leading clinical, industry, and public health experts. You can also earn valuable CNE contact hours.View the 2017 preliminary program.
Discover emerging issues.
Stay ahead of industry hot topics and discuss how to prevent problems before they become unmanageable. You’ll find plenaries, sessions, workshops, and abstract presentations on critical issues like multidrug-resistant organisms, public reporting and NHSN, and safe injection practices.
Experience the latest tools and technology.
Explore the leading edge of science and technology in the largest exhibit hall dedicated to infection prevention. Browse 270+ exhibits, learn about scientific advances in equipment and devices, and experience hands-on demonstrations of the latest technology and in-booth learning opportunities.
Share the learning.
The professional development doesn’t stop at the end of the conference. Every attendee receives a copy of the standard conference proceedings, which includes all the educational sessions synced with presentation slides so that you can go back and catch up on what you missed and share contents with the rest of your team.
Connect (and reconnect) with colleagues.
Looking for networking opportunities? From the welcome reception to the closing plenary, the conference offers unsurpassed opportunities to network with healthcare professionals from across the United States and around the world.